Technology – Medium Level – GK Questions

Metamaterials are engineered structures with sub-wavelength features enabling exotic properties: negative refraction, invisibility cloaking, superlenses. Applications: antennas, sensors, imaging. India researches at IITs, DRDO. Critical for advanced materials and photonics questions.

TSV (Through-Silicon Via) creates vertical electrical connections through silicon dies, enabling 3D chip stacking for higher bandwidth, lower power, and smaller footprint. Critical for advanced packaging in HPC, mobile, and AI chips. India focuses on ATMP capabilities.

PTES (Penetration Testing Execution Standard) defines phases: pre-engagement, intelligence gathering, threat modeling, vulnerability analysis, exploitation, post-exploitation, reporting. Ensures consistent, comprehensive security assessments. Critical for professional cybersecurity practice questions.

IN-SPACe authorizes/facilitates private space activities; NSIL (NewSpace India Limited) commercializes ISRO technologies via industry partnerships. Together they enable India's space economy growth. Critical for understanding space sector reforms and entrepreneurship questions.

V2G enables bidirectional power flow: EVs charge during low demand, discharge during peak, providing grid services (frequency regulation, backup). Requires smart chargers, communication protocols, and regulatory frameworks. Critical for smart grid and energy transition questions.

Nano-ZnO/TiO2 provide broad-spectrum UV protection while being transparent on skin vs micron-sized particles that leave white cast. Safety: coated nanoparticles minimize skin penetration. India regulates nanomaterials in cosmetics. Critical for nanotech applications and consumer safety questions.

Doping introduces controlled impurities (phosphorus for n-type, boron for p-type) to create PN junctions, transistors, and diodes. Foundation of semiconductor device physics. Critical for understanding chip functionality and manufacturing questions.

In-orbit servicing (robotic arms, refueling, upgrades) extends satellite life, reduces space debris, and enables new business models. ISRO's SPADEX tested docking; global companies (Northrop, Astroscale) develop servicing tech. Critical for space sustainability and economy questions.

NMC (Lithium Nickel Manganese Cobalt Oxide) offers high energy density for EV range, balanced with cost and safety. LFP (Lithium Iron Phosphate) is safer, cheaper, longer-life but lower energy density. India's ACC PLI supports both. Critical for EV technology questions.

Silicon wafers (single-crystal, polished discs) are foundational substrate for IC fabrication due to: abundance, mature processing, and suitable electronic properties. Compound semiconductors (GaAs, SiC) used for specialized applications. Critical for understanding chip manufacturing basics.

Social engineering (phishing, pretexting, baiting) exploits human trust, curiosity, or fear to gain access or information. Often more effective than technical exploits. Defense: security awareness training, verification protocols, and least-privilege access. Critical for holistic cybersecurity understanding.

OneWeb (partly Indian-owned via Bharti Group) operates LEO satellite constellation for global broadband, especially rural/remote areas. Competes with Starlink. Critical for digital connectivity and space commerce questions. NavIC is navigation; GSAT is communication; CARTOSAT is earth observation.

CAES stores energy by compressing air during low demand, releasing through turbines during peak. Adiabatic CAES recovers compression heat for higher efficiency. Suitable for large-scale, long-duration storage. India explores CAES for renewable integration. Critical for grid-scale storage questions.

Aerogels are ultra-light porous materials (~99% air) with extremely low thermal conductivity, making them excellent insulators. Used in Mars rovers, spacecraft, and building insulation. India researches aerogels at ISRO and IITs. Critical for materials science and space tech questions.

Chiplets integrate multiple specialized dies (CPU, GPU, I/O) via advanced packaging (2.5D/3D), improving yield, cost, and design flexibility vs monolithic chips. Used in AMD, Intel products. India's semiconductor strategy includes ATMP (assembly, test, mark, pack) capabilities. Critical for chip design questions.

Nmap (Network Mapper) scans networks for hosts, ports, services, and OS detection. Foundation for vulnerability assessment. Wireshark is packet analyzer; Metasploit is exploitation framework; John the Ripper is password cracker. Critical for cybersecurity tools knowledge in exams.

IN-SPACe (Indian National Space Promotion and Authorization Centre) is single-window regulator for private sector space activities: licensing, facilitation, technology transfer. Established under DOS to implement space policy reforms. Critical for understanding India's space governance framework.

Shape-memory alloys (Nitinol: Ni-Ti) undergo reversible phase transformation, enabling shape recovery upon heating. Applications: medical stents, actuators, aerospace. India researches SMAs at DMRL, IITs. Critical for smart materials and advanced manufacturing questions.

Photolithography uses light to transfer mask patterns onto photoresist-coated wafers, defining circuit features. Critical for miniaturization; EUV lithography enables sub-7nm nodes. Other steps: deposition (add layers), etching (remove material), doping (modify conductivity). Critical for chip manufacturing questions.

Web Application Penetration Testing (DAST - Dynamic Application Security Testing) identifies vulnerabilities: SQL injection, XSS, CSRF, auth flaws. Tools: Burp Suite, OWASP ZAP. Critical for securing digital services and compliance with security standards in banking/government exams.