technology medium true/false

Chiplet architecture enables modular design by combining multiple smaller dies in a single package.

  1. True
  2. False

Answer: True

Chiplets integrate multiple specialized dies (CPU, GPU, I/O) via advanced packaging (2.5D/3D), improving yield, cost, and design flexibility vs monolithic chips. Used in AMD, Intel products. India's semiconductor strategy includes ATMP (assembly, test, mark, pack) capabilities. Critical for chip design questions.

Topic Semiconductor Technology
Exam Relevance UPSC, Banking, SSC

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